Chroma 7505 Series Semiconductor Advanced Packaging Optical Metrology System applies White Light Interference Measurement Technique to perform nondestructive and rapid surface profile measurement and analysis. Measurement capabilities include: Step Height, Critical Dimension (CD) and etch depth of TSV (Through Silicon Via) structures, Overlay (OVL), and Film Thickness. Its large vertical and horizontal axial scanning range is suitable for a variety of automatic measurement applications with maximum measurement size up to 12” wafer. The system provides Fast Autofocus algorithm, Large Area Pictures Stitch function, and recipe measurement with automatic inspection capability. In addition, it also offers storage function to save the measured data making the analysis work easy for operators.